Register
Login
Help
Book Store price: $89.95
FABRICATION ENGINEERING AT THE MICRO AND NANOSCALE (THE OXFORD SERIES IN ELECTRICAL AND COMPUTER ENGINEERING)
ISBN: 0195320174
ISBN 13: 9780195320176
Author: STEPHEN A. CAMPBELL
Edition: 3 rd
Publisher: OXFORD UNIVERSITY PRESS, USA
Publication Date: Sep 17, 2007
Pages: 672
ISBN 13: 9780195320176
Author: STEPHEN A. CAMPBELL
Edition: 3 rd
Publisher: OXFORD UNIVERSITY PRESS, USA
Publication Date: Sep 17, 2007
Pages: 672
Book Summary
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.
The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco AthenaRG set of codes--to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition.
The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.
Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes.
The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite--the Silvaco AthenaRG set of codes--to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition.
The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.
Back
